EBSD is used widely in industrial scientific research in applications concerned with:

• Texture measurement in sheet materials in the steel and aluminium industry for quality control applications.
• Study of texture in sheet steel and aluminium for improved formability and surface finish.
• Study of texture in relation to electrical and magnetic properties.
• Influence of grain boundary properties on corrosion, fracture and fatigue in metal manufacturing and nuclear power industries.
• Retained ferrite and austenite measurement for steel property enhancement.
• Through thickness texture measurements of sputter targets for quality control applications.
• Analysis and orientation measurement of second phase particles for materials property enhancement and component lifetime prediction.
• Baseline measurement of grain sizes in microelectronic interconnects.
• Development of thin film devices.
• As a complementary technique to qualify and improve traditional techniques such as optical microscopy and X-ray diffraction.
• Microscopic studies of texture (preferred orientation measurements) and the relation of microtexture to microstructure.
• As a complementary technique to X-ray diffraction for the study of texture on a macroscopic scale.
• Studying recrystallisation in metals and alloys.
• Study of microstructure, in particular the capability of crystal orientation maps to reveal unambiguously the presence, location and size of grains.
• Measurement of grain boundary misorientations and the relation of grain boundary types to phenomena such as segregation, corrosion, precipitation, fatigue and fracture resistance.
• Distribution of grain boundary misorientations, twin boundaries and other special boundaries including their effect of material properties.
• Texture development, electromigration and reliability in copper and aluminium microelectronic interconnects.
• Study of fabric in geological materials.
• Thin films, in particular growth of epitaxial layers with applications in solar cells, thin film transistors, non volatile memories, ferroelectric films, and light emitting and laser diodes.
• Influence of grain boundary properties on fracture.
• High temperature superconductors, including the influence of texture and grain boundary type on superconducting properties.
• Measurement and distribution of strain in deformed materials
• Orientation of secondary phases and precipitates.
• Phase identification, discrimination and fraction determination including analysis of intermetallic materials, carbides and hydrides.
• Retained ferrite/austenite measurement in particular at microscopic levels.
• Through thickness variations in texture, for example in sputtering targets.
• Combination with focussed ion beams for three dimensional analysis of materials.

And much ...much more...